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							180 lines
						
					
					
						
							3.9 KiB
						
					
					
				
			
		
		
	
	
							180 lines
						
					
					
						
							3.9 KiB
						
					
					
				| { | |
|   "Header": { | |
|     "GenerationSoftware": { | |
|       "Vendor": "KiCad", | |
|       "Application": "Pcbnew", | |
|       "Version": "6.0.4-6f826c9f35~116~ubuntu20.04.1" | |
|     }, | |
|     "CreationDate": "2022-03-30T05:15:32+01:00" | |
|   }, | |
|   "GeneralSpecs": { | |
|     "ProjectId": { | |
|       "Name": "step32", | |
|       "GUID": "73746570-3332-42e6-9b69-6361645f7063", | |
|       "Revision": "rev?" | |
|     }, | |
|     "Size": { | |
|       "X": 55.1, | |
|       "Y": 64.1 | |
|     }, | |
|     "LayerNumber": 4, | |
|     "BoardThickness": 1.5954, | |
|     "Finish": "HAL lead-free", | |
|     "ImpedanceControlled": true | |
|   }, | |
|   "DesignRules": [ | |
|     { | |
|       "Layers": "Outer", | |
|       "PadToPad": 0.2, | |
|       "PadToTrack": 0.2, | |
|       "TrackToTrack": 0.2, | |
|       "MinLineWidth": 0.2, | |
|       "TrackToRegion": 0.508, | |
|       "RegionToRegion": 0.508 | |
|     }, | |
|     { | |
|       "Layers": "Inner", | |
|       "PadToPad": 0.0, | |
|       "PadToTrack": 0.0, | |
|       "TrackToTrack": 0.2, | |
|       "TrackToRegion": 0.508, | |
|       "RegionToRegion": 0.508 | |
|     } | |
|   ], | |
|   "FilesAttributes": [ | |
|     { | |
|       "Path": "step32-F_Cu.gtl", | |
|       "FileFunction": "Copper,L1,Top", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-In1_Cu.g2", | |
|       "FileFunction": "Copper,L2,Inr", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-In2_Cu.g3", | |
|       "FileFunction": "Copper,L3,Inr", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-B_Cu.gbl", | |
|       "FileFunction": "Copper,L4,Bot", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-F_Paste.gtp", | |
|       "FileFunction": "SolderPaste,Top", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-B_Paste.gbp", | |
|       "FileFunction": "SolderPaste,Bot", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-F_Silkscreen.gto", | |
|       "FileFunction": "Legend,Top", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-B_Silkscreen.gbo", | |
|       "FileFunction": "Legend,Bot", | |
|       "FilePolarity": "Positive" | |
|     }, | |
|     { | |
|       "Path": "step32-F_Mask.gts", | |
|       "FileFunction": "SolderMask,Top", | |
|       "FilePolarity": "Negative" | |
|     }, | |
|     { | |
|       "Path": "step32-B_Mask.gbs", | |
|       "FileFunction": "SolderMask,Bot", | |
|       "FilePolarity": "Negative" | |
|     }, | |
|     { | |
|       "Path": "step32-Edge_Cuts.gm1", | |
|       "FileFunction": "Profile", | |
|       "FilePolarity": "Positive" | |
|     } | |
|   ], | |
|   "MaterialStackup": [ | |
|     { | |
|       "Type": "Legend", | |
|       "Color": "White", | |
|       "Name": "Top Silk Screen" | |
|     }, | |
|     { | |
|       "Type": "SolderPaste", | |
|       "Name": "Top Solder Paste" | |
|     }, | |
|     { | |
|       "Type": "SolderMask", | |
|       "Color": "Green", | |
|       "Thickness": 0.0127, | |
|       "Name": "Top Solder Mask" | |
|     }, | |
|     { | |
|       "Type": "Copper", | |
|       "Thickness": 0.035, | |
|       "Name": "F.Cu" | |
|     }, | |
|     { | |
|       "Type": "Dielectric", | |
|       "Thickness": 0.1, | |
|       "Material": "Prepreg 2313", | |
|       "DielectricConstant": "4.05", | |
|       "LossTangent": "0.02", | |
|       "Name": "F.Cu/In1.Cu", | |
|       "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" | |
|     }, | |
|     { | |
|       "Type": "Copper", | |
|       "Thickness": 0.0175, | |
|       "Name": "In1.Cu" | |
|     }, | |
|     { | |
|       "Type": "Dielectric", | |
|       "Thickness": 1.265, | |
|       "Material": "FR4", | |
|       "DielectricConstant": "4.6", | |
|       "LossTangent": "0.02", | |
|       "Name": "In1.Cu/In2.Cu", | |
|       "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" | |
|     }, | |
|     { | |
|       "Type": "Copper", | |
|       "Thickness": 0.0175, | |
|       "Name": "In2.Cu" | |
|     }, | |
|     { | |
|       "Type": "Dielectric", | |
|       "Thickness": 0.1, | |
|       "Material": "Prepreg 2313", | |
|       "DielectricConstant": "4.05", | |
|       "LossTangent": "0.02", | |
|       "Name": "In2.Cu/B.Cu", | |
|       "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" | |
|     }, | |
|     { | |
|       "Type": "Copper", | |
|       "Thickness": 0.035, | |
|       "Name": "B.Cu" | |
|     }, | |
|     { | |
|       "Type": "SolderMask", | |
|       "Color": "Green", | |
|       "Thickness": 0.0127, | |
|       "Name": "Bottom Solder Mask" | |
|     }, | |
|     { | |
|       "Type": "SolderPaste", | |
|       "Name": "Bottom Solder Paste" | |
|     }, | |
|     { | |
|       "Type": "Legend", | |
|       "Color": "White", | |
|       "Name": "Bottom Silk Screen" | |
|     } | |
|   ] | |
| }
 | |
| 
 |